Staggered (Interstitial) PGA Sockets

Low Insertion Force Pin Grid Array Sockets for prototyping or production. 100" (2.54mm) Pitch Interstitial Footprints Features:

• Available in new LCP high temperature molded insulators (RSX) or Peel-A-Way removable terminal carriers (KSX)
• .100" (2.54mm) centers pin to pin
• Multiple finger contact for reliability
• Tapered entry for ease of insertion
• Closed end construction for 100% anti-wicking of solder
• Available with SnPb or lead-free Sn/Ag/Cu solder preform terminals
• Available with Matte Tin/Gold or Gold/Gold terminal/contact plating for RoHS Compliant applications

Terminals: Brass - Copper Alloy C36000, ASTM-B-16 Contacts: Beryllium Copper - Copper Alloy C17200, ASTM-B-194 RoHS Compliant: G - Gold over Nickel or M - Matte Tin over Nickel RoHS Noncompliant: T - Tin-Lead over Nickel RoHS Compliant: G - Gold over Nickel RoHS Noncompliant: T - Tin-Lead over Nickel Material: RSX - LCP Liquid Crystal Polymer KSX - Polyimide Film Peel Away: Y RSX: -40C to 260C (-40F to 500F) KSX: -269C to 400C (-452C to 752F) Prime Distributing Co. is an Authorized Distributor for Advanced Interconnections and has been a leader in technical socket sales with kindly service for over 35years.