QFN Test/Burn-In Socket, Open Top from Antares
Low cost design using stamped cantilever contact.
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Details
FEATURES
- 0.4mm and 0.5mm pitch
- Low cost design using stamped cantilever contact.
- Staggered, through hole tail design for BIB design consideration.
- ACTIVE ALIGNMENT: Active IC guide feature improving on package alignment accuracy.
- Optional thermal contact for package e-pad.
QFN Test/Burn-In Socket, Open Top from Antares Reviews
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