Peel-A-Way PGA Sockets

Patented Peel-A-Way Low Insertion Force Pin Grid Array Sockets Designed for Low Profile Applications Features:

• RoHS Compliant, disposable carriers peel away after soldering
• Peel-A-Way tabs and full grid wafer supplied
• 1 oz. (28.34g) average insertion force
• Maximum air flow under PGA for greater cooling
• Better flux rinse and cleaning
• Allows inspection of solder joints on both sides of PCB
• Available with Gold/Gold or Matte Tin/Gold plating for lead-free compatible processing Terminals: Brass - Copper Alloy (C36000), ASTM-B-16 Solder Preforms: Available in standard Sn/Pb or lead-free Sn/Ag/Cu Contacts: Beryllium Copper - Copper Alloy (C17200) ASTM-B-194 RoHS Compliant: G - Gold over Nickel or M - Matte Tin over Nickel Non-RoHS Compliant: T - Tin-Lead over Nickel RoHS Compliant: G - Gold over Nickel Non-RoHS Compliant: T - Tin-Lead over Nickel Material: Polyimide Film Peel Away: Y Temp: -269C to 400C (-452F to 752F)