BGA/LGA Test/ Burn-In Enplas Socket. SMT, Clam-Shell Lid. 2009-2

BGA/LGA Test, Burn-In Socket. SMT type, Clam Shell lid design. from ENPLAS, leading manufacturer in socket design and manufacturing.
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FEATURES

  • Ball/Land Grid Array Socket, Surface Mount type, with unique Probe Pin Type contact.
  • Clam Shell lid design.
  • Available as "C Series".
  • IC Application: BGA 0.8mm and 1.0mm. From grid count of 1156 to 3136.
  • Items are NCNR.

For more information regarding Enplas sockets, visit their homepage.

RELATED DOCUMENTS BGA/LGA SMT Test Socket Product Data Sheet

Contact Prime for your RFQ. Pricing will be determined by quantity.

You can often get better pricing through Prime than direct from the factory.

Our long-time relationship as wholesaler usually allows us to pass on savings to our customers.

Prime Distributing Co. is an Authorized Distributor for ENPLAS and leader in technical socket sales with kindly service for over 35 years.

BGA/LGA Test/ Burn-In Enplas Socket. SMT, Clam-Shell Lid. 2009-2 Reviews

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