BGA/LGA Failure Analysis Socket

FEATURES

The socket lid height is minimized to prevent lens interference and an aperture is cut into the lid or the base of the socket to allow access to the die.

The socket can be designed in conjunction with the required board to insure adequate apertures in the board relative to the socket.

Cavity up or cavity down versions are available.

For BGA/LGA devices pogo pin contacts can be used so that it is easier to contact pads which have balls partially or fully removed.

For peripheral leaded devices, it is possible to have direct contact between the device leads and the pc boards or the pogo style contact. The Micro Pogo Pin operates at -45° to +150° temperature.

Delivery 6 - 8 weeks.

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