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UNIPOL-1202 machine is equipped with 12" super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" in diameter. It can be used as a standard grinding and polishing machine for preparing metallographic samples as well. With combination of polishing auxiliaries, such as flat sample holder ( included) three hole metallographic sample holder (Optional ), precision Thinning fixture (optional), and slurry feeder (optional), Unipol 1202 can lap and polish various samples automatically.
Features:
Precision rotating shaft with running off
Two super flat lapping plate with flatness 2 . One cast iron plate for lapping and one cast aluminum plate for polishing
Heavy duty cast aluminum case with bright painting
Two rocking work stations with wafer holders and condition rings, which can be controlled independently for polishing 2 pcs of 4" wafers in same time.
Variable speed from 0 to 150 RPM with digital display
Adjustable timer for auto-stop up to 99 hours
Auto slurry feeder is an
optional part for polishing automatically
Typical Specifications
Super-Flat 12" ( 300 mm) Diameter Lapping Plate
Flatness 2
Precision Rotating Shaft
Running Off
Heavy Duty Cast Aluminum Case with Painting
Color : Black or White
Two Work Stations with 80 Rocking and adjustable speed
9 rocking / minute
Two flat sample holders for
carrying
105 Dia. x 35 T mm
Two Condition Rings
120 O.D. x 110 I.D. x 32 T mm
Variable Speed of Master Plate with Digital Display
from 0 ~ 150 rpm
Adjustable Timer for Auto-Stop
0 - 99 hours
Automatic Slurry Feeder
Optional for automatic polishing
Power
120V or 240 V selectable via switch
Motor
300 W high torque DC motor
Dimension
700 L x 475 W x 300 H (mm)
Weight
154 lbs
Dimension of shipment
43" x 31" x 33"
Weight of shipment
200 Lbs
Warranty
one year
View product
manual About shipping / handling
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