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Diamond Lapping Film consists of precision graded diamond particles resin bonded to a flat, uniform polyester film backing. It provides excellent edge retention and maintains coplanarity regardless of varying materials or hardness within the sample. Typically it is used for unencapsulated cross- sectioning, TEM wedge/plan-view polishing, backside polishing and pre-FIB sample thinning
pressure-sensitive adhesive (PSA) backing for easy operation
Diamond grit is selectable at 0.1, 0.25, 0.5, 1.0, 3.0, 6.0, 9.0, 15 and 30 micron
Fit to MTI Unipol-802 polishing machine
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