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Plastic Foam Module Wafer Carrier is a solution for valued and fragile devices. This packing is designed to protect delicate parts during transport, processing, inspecting, and assembly. Also it has been applied largely in many fields like optical materials, opto-electonic components, semiconductor, and optical communication. The structure consists of three cushions, the middle cushion called module cushion can be customized to specific shape to hold the devices exactly and safely.
Specifications:Type: SP4-8512H-T/BKOutside Dimension: 85 x 85 x 12 (mm3)Inside Dimension: 3 " diameterColor of Cover/ Background: Trans / BlackModule Structure in Center: Two
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