LaAlO3, orn. 5 x 5 x 0.5 mm substrate , 2 side Epi polished
LaAlO3, orn. 5 x 5 x 0.5 mm substrate , 2 side Epi polished
Specifications Wafer Size: 5 x 5 x 0.5 mm thickness +/-0.05 mm, Wafer Orientation: (100) +/-0.5 Deg Polishing: Two sides CMP polished with free sub-surface damaged. Surface Roughness: Packed Under 1000 class clean room. (EPI ready) and in 100 grade plastic bog in a wafer continaer.
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