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Diamond wire cutting is a state of the art technology to slice single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contaimination free coolant during crystal cutting. Through several years effort, finally, MTI provides market a quality diamond wire with reasonable price.Features:
Electroplated diamond wire with 0.28 mm diameter based on a high strength steel wire
40 microns diamond particle (280 grit) for effectively cutting and slicing of ceramic and crystal.
65 meters ( 215 feet ) per roll as standard package
Perfect for various diamond wire saws in the market
Save 50% or more than any competitor.
Suitable for diamond wire saws, including Well-Diamond, Diamond Wire Technology, MTI etc
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