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UNIPOL1501 machine equips with 14 -15" diameter super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" diameter with three work stations. It also can be adopted a standard grinding and polishing machine for preparing metallographic samples. MTI provides you with cost effective polishing machine to meet your budget and application.
Features of Unipol 1501
Specifications of Unipol 1501
Precision rotating shaft with running off
Two super flat lapping plate with flatness 2, one cast iron plate for lapping and one cast aluminum plate for polishing
Heavy duty cast aluminum case with bright painting
Three fixed work station with wafer holder and condition ring, which can polish 3 pcs of 4" wafers and 9 pcs of 2" wafers in one running
Variable speed from 0 to 500 RPM with digital display
Adjustable timer for auto-stop up to 99 hours
Optional auto slurry feeder
Power: 120V or 240 V selectable
Motor: 0.26 KW high torque DC motor with one year warranty
Speed: Variable from 0 to 500 RPM with digital display
Timer: 1 minute ~ 99.99 hours
Condition ring: 140 OD x 108 ID x 25 T ( mm )
Wafer Holder: 105 Dia. x 32 T ( mm )
Dimension: 650L x 510W x 300H (mm)
Weight: 95 Kg
Package dimension: 36" x 30" x 20"
Shipping weight: 220 lbs
Please view Operational Manual About shipping / handling
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